BERGSONNETiles compartmentalize the complexity of modern electrical subsystems into fully-integrated, plug-and-play microelectronic modules — carrying a design from first concept all the way through mass production on the very same hardware.
Think of Tiles as a library of pre-built, snap-together building blocks — each a complete, tested subsystem. Compress months of custom hardware work into days, on a platform that carries you from first prototype to full production.
Choose from 75+ modules spanning compute, sensing, connectivity, power, and actuation.
Combine modules into a configuration that matches your product — no custom PCB at the prototype stage.
Move to production on the same modules your prototype used — no redesign, no requalification, no surprises.
As semiconductors grow more capable and more miniature, laying out, fabricating, assembling, and packaging embedded electronics gets harder every year. Tiles absorb that complexity into a single standardized module — so the hard parts ship once, inside the tile.
Modularizing at the subsystem level lets a design move from first prototype to full production on the same hardware — no redesign, no PCB respins. Engineers spend their time on product and experience instead of bottlenecks, fab rounds, and cost.
Most tiles conform to a 4.0 × 4.0 mm T44 package — ten surface-mount pads down the left and right edges at a 0.8 mm pitch, epoxy-encapsulated, 1.0–2.0 mm tall. Orientation reads from the marking dot above or the extended first pad below.
Every T44 tile shares a power layout — GND on pad 1, supply on pad 10 — and most speak standard I3C with clock on pad 4 and data on pad 5. The remaining six pads are tile-specific: SPI, analog, interrupts, and GPIO.
A solderless tile-to-breadboard adapter brings true plug-and-play to the bench. Pads arranged left-to-right make wiring multiple tiles into larger systems fast and intuitive.
Solder, conductive adhesive, your call. With 0.4 mm traces and all the complexity inside the tile, simple single-sided carrier boards can be auto-generated and printed, laser-etched, or fabbed on cheap equipment — then reversed for effortless reuse.
Drivers handle register configuration, data parsing, and protocol negotiation, while a thin Platform Abstraction Layer bridges tiles to your processor. Ready for STM32-based Core tiles today; ESP32, Arduino, and nRF ports are next.
Compose tile systems, wire up behavior, and simulate firmware right in the browser — then build a binary and flash it. No toolchain to install, no board to wait for.
From a compact haptic ring to multi-sensor wearables — fully documented builds, and ready-made starting points for your own projects.
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