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Bergsonne Labs

Core.W

BLE-enabled 100MHz Cortex M33

The Core.W tile combines the powerful STM32WBA55 100-MHz 32-bit Cortex-M33 processor together with an integrated 2.4GHz antenna on double-size T48 (4.0 x 8.0 mm) SMD package. The tile provides a user-configurable combination of: SW debug & bootloading; 1MB flash & 128KB SRAM; wireless communications (BLE 5.4, Thread, Matter, Zigbee, proprietary); two FM+ (1MHz) I2C ports; two SPI ports; one USART; five 12-bit 2.5Msps ADC inputs (16-bit with oversampling); many timers; ten capacitive touch inputs; one serial-audio interface; IR output; and an on-board LED

Product Info

Status
Production
In Stock
35
Pricing
QtyEach
1+$20.00
10+$18.00
50+$17.00

Technical Summary

Package
T48-16 (PDF)
Supplies
1.8–3.6V
Component
STM32WBA55HGF6 (PDF)
Interfaces
I2CSPIUSARTSAI

Resources & Links

Datasheet
Download PDF
JSON Tile Definition
v0.22 (Feb 14, 2026)
ECAD Libraries
Eagle|KiCad
Drivers
GitHub
Discussion
Discord

Application Notes

Single-Wire Debug & Bootloading

The single-wire debug port is available on pads 13 (SWCLK) and 14 (SWDIO). While not absolutely required, it is often helpful to have the ability to hold pads 22 (NRST) low when connecting to the debugger. You can likely also use BOOT0 to help the debugger connect.

Antenna Clearance

For the best wireless performance, the antenna-end of the Tile (the end without any pads) should not have any copper traces or planes above or below it.

LED

The onboard LED is connected to PB12 in an active-high configuration.

Pad Assignments

12345678910111213141516T48-16(top view)
PadDAI2CSPISAIUSARTIF
1GND··········
2·A09·3.CLK···1.2N, 3.3, 3.ETR, LP1.IN1·G2.IO2
3·A54·3.CS1.D2··2.1, LP2.ETR·G1.IO4
4·A633.CLK·1.CK2, 1.MCLK_A··2.4·G1.IO3
5·A723.DAT·1.SCK_A··2.3·G1.IO2
6·B8··3.MOSI·2.RX·1.1, 3.ETR, 16.1N, LP1.ETR·G2.IO4
7·B910·3.MISO··IR_OUT1.3N, 3.4, 16.1, LP2.IN1·G2.IO3
8·A12··1.CS·2.TX·1.2·G3.IO4
9·B4··1.CLK1.MCLK_B2.RX·1.3, 17.1, LP2.IN2·G3.IO1
10·A15·1.CLK1.MOSI·2.RTS_DE·1.ETR, LP1.2··
11·B3·1.DAT1.MISO·2.CK·1.4, 171.N, LP1.IN2·G3.IO2
12·A13······17.BKINSWDIOG3.IO3
13·A14····2.TX··SWCLK·
14V+··········
15·H3·······BOOT0·
16·········NRST·

I2C1

I2C
Mode
master, slave
Max Clock
1MHz
Address
programmable
Format
FunctionRequiredPad(s)
I2C1.CLKYes10
I2C1.DATYes11

I2C3

I2C
Mode
master, slave
Max Clock
1MHz
Address
programmable
Format
FunctionRequiredPad(s)
I2C3.CLKYes4
I2C3.DATYes5

SPI1

SPI
Mode
master, slave
Max Clock
Address
Format
FunctionRequiredPad(s)
SPI1.CSNo8
SPI1.CLKNo9
SPI1.MOSINo10
SPI1.MISONo11

SPI3

SPI
Mode
master, slave
Max Clock
Address
Format
FunctionRequiredPad(s)
SPI3.CLKNo2
SPI3.CSNo3
SPI3.MOSINo6
SPI3.MISONo7

USART2

USART
Mode
Max Clock
Address
Format
FunctionRequiredPad(s)
USART2.RXNo6, 9
USART2.TXNo8, 13
USART2.RTS_DENo10
USART2.CKNo11

SAI1

SAI
Mode
Max Clock
Address
Format
FunctionRequiredPad(s)
SAI1.D2No3
SAI1.CK2No4
SAI1.MCLK_ANo4
SAI1.SCK_ANo5
SAI1.MCLK_BNo9

Development Product — This is an electronic development module intended for evaluation, prototyping, and integration into other designs by qualified engineers and developers. It is not a finished consumer product and has not been independently certified for FCC, CE, UL, or other regulatory compliance. The integrator of this module into a finished product is responsible for obtaining all necessary certifications. Not intended for use in life-support systems, safety-critical applications, or any application where failure could result in personal injury or property damage. See our Terms of Sale for full details.