BERGSONNE

Implementation status

The same core_* API and behavior DSL target every Core — this page is the honest map of how far each one is along, and where the platform is headed across architectures. One contract, many implementations.

Under review — statuses are being reconciled
The SDK’s canonical feature list and the per-Core status files have drifted apart, so a number of shipping, tested capabilities — notably USB, BLE, and programming / debug — currently show as planned here even though they’re implemented. Treat the matrix as indicative until the source data is reconciled.

Overview

A peripheral feature is “done” on a Core when the layers beneath the core_* API are implemented for that MCU and the result is checked on hardware. Because the contract is shared, this is the only thing that varies between Cores — so a single matrix captures the whole platform.

Today the shipping Cores are STMicroelectronics Arm Cortex-M parts. WCH (RISC-V) and Nordic (nRF54) Cores are in development; when they arrive they populate the same matrix without changing a line of your firmware.

Status, not marketing
Statuses are synced from the SDK’s own status files (May 2026). Verified means checked on real hardware; compiles means the code builds but hasn’t been hardware-verified yet.

Cores by architecture

Cores are named by vendor and series — Core.ST.L4, Core.CH.*, Core.N.*. The vendor segment is the architecture seam: everything above the core_* line is shared, everything below is re-implemented per family.

STMicroelectronics

· Arm Cortex-MShipping

The Cores shipping today, from an ultra-low-power M0+ up to a 250 MHz M33. The full feature matrix below is measured against these.

Core.ST.L0
STM32L011
M0+ · 32 MHz
Core.ST.L4
STM32L422
M4 · 80 MHz
Core.ST.W5
STM32WBA55
M33 · 100 MHz
Core.ST.H5
STM32H523
M33 · 250 MHz

WCH

· RISC-VIn development

RISC-V Cores bringing a lower-cost architecture to the same tile platform. The core_* API and behavior DSL are unchanged — only the layers beneath are re-implemented.

In development — same core_* contract, drivers via the PAL.

Nordic

· Arm Cortex-M33In development

nRF54 Cores adding modern wireless (BLE / 802.15.4) alongside the Arm M33 line. Same contract, same drivers via the PAL.

In development — same core_* contract, drivers via the PAL.

Feature support matrix

Features by group, against the shipping Cores. Each entry carries the SDK layer it reaches (LL → HAL → TAL → Core); a layer implies everything beneath it.

FeatureLayerL0M0+L4M4W5M33H5M33
System
core initializationCore
LEDStudio
delay (ms / µs)Studio
SysTickLL
fault handlers
Clocks
HSI (internal RC)LL
HSE (external crystal)LL···
MSI / MSIS (low-power)LL··
CSI (low-power internal)LL···
PLL (high-speed)LL
GPIO
digital I/O (read / write)Studio
EXTI (external interrupts)Studio
alternate function configLL
open-drain / pull configCore
UART
TX / RX (polling)Core
interrupt-drivenCore
DMACore
hardware flow control
LPUART (low-power)Core
I2C
standard mode (100 kHz)Core
fast mode (400 kHz)Core
fast-mode plus (1 MHz)··
interrupt-drivenCore
DMA
10-bit addressingCore
SMBus mode
SPI
master TX / RX (polling)Core·
interrupt-drivenCore·
DMACore·
slave mode·
OctoSPI / QSPI···
Timers
basic timebase / tickStudio
PWM outputStudio
input captureCore
one-shot pulse
encoder mode
LPTIM (low-power timer)
IWDG (watchdog)Studio
ADC
single-shot raw readStudio
millivolt read (VREFINT)Studio
temperature sensorStudio
resolution (8 / 10 / 12-bit)Core
oversampling / burstCore
DMACore
continuous / scan modeCore
analog watchdog
Project Generation (Coregen)
GPIO pad auto-initCore
I2C auto-initCore
analog pad initCore
SPI auto-initCore·
UART auto-initCore
timer / PWM auto-initCore
Power Management
sleep modeCore
STOP modeCore
standby / shutdownCore
RTC wakeupStudio
EXTI wakeupCore
wakeup pin (Standby)Core
RTC Alarm AStudio
backup registersStudio
Security
hardware RNG·
AES (hardware)·
PKA / ECC···
HASH (SHA-256)···
Connectivity
USB CDC serialStudio··
USB HID··
USB MSC··
ROM DFU bootloader··
BLE radio···
BLE advertising···
BLE GATT server···
FDCAN···
Advanced
I3C controller···
I3C target···
COMP (analog comparator)·
DACStudio···

Legend

Status of each feature on each Core:

  • Verified on hardware
  • Compiles (not yet hardware-verified)
  • Partial
  • Planned
  • ·Not applicable to this MCU

The Layer column uses the SDK’s stack vocabulary — see SDK layers & API tiers. A higher layer implies the ones beneath it are present too.